All of the involved parties collaborated closely before using tesa. “When we take part in this kind of development process, we meet with the client to see what characteristics our products have to provide,” reports Rainer Pletz, in charge of technical quality testing for specific applications at tesa. In combination with an extremely small area of adhesion, the challenge in the smart card project lies in fusing together the rigid module and the flexible card body. To accomplish this, researchers developed a solution from the HAF product family, which utilizes heat-activated film that becomes adhesive only at high temperatures. The module and the prepared plastic card are welded together at about 200 degrees Celsius, using tesa® 8410 or 8440.

The fascination of technology – high-performance microchips can store up to 256 megabytes.

Superior expertise and long-term relationships

So that clients such as Sagem Orga can rely on precisely tailored, high-quality applications, it is tesa’s practice to maintain close ties and regularly solicit feedback. Matthias Becker, for example, is constantly on the road visiting clients both within the region and in other regions of Germany. The sectors that Becker serves as Special Application Manager include the smart card industry.

“Our aim is to develop superior technical expertise and long-term relationships,” says the 31-year-old sales specialist, describing his day-to-day work. “The thing that sets my job apart is my daily dealings with people from different industries and sectors. I find it exciting to learn something about trends and then see that knowledge transformed into new solutions by tesa,” says Becker, who is the link between customer service and Rainer Pletz’s lab. The lab developed an improvement for Sagem Orga just last year. Thanks to varying roll cores, the two tesa products the plant uses can now be easily differentiated even from a distance. A simple, but effective solution: now chip card production employees can select products at just a glance.